Ddr4 SdramHardware / appliance · Micron

CVE-2020-10255

CRITICAL · 9.0 CVSS v3.1 Published 2020-03-10
Mitigation only
No fix yet — a mitigation exists. There is no fixed release. A documented workaround reduces exposure in the meantime.
See remediation →
99/100
Remediation priority · Urgent
Remotely reachable No privileges Zero-click

Official description Straight from the sourceThe vendor's or NVD's own wording, published unedited. Authoritative, but often terse — it says what broke, rarely what to do.

NVD · unedited
Modern DRAM chips (DDR4 and LPDDR4 after 2015) are affected by a vulnerability in deployment of internal mitigations against RowHammer attacks known as Target Row Refresh (TRR), aka the TRRespass issue. To exploit this vulnerability, the attacker needs to create certain access patterns to trigger bit flips on affected memory modules, aka a Many-sided RowHammer attack. This means that, even when chips advertised as RowHammer-free are used, attackers may still be able to conduct privilege-escalation attacks against the kernel, conduct privilege-escalation attacks against the Sudo binary, and achieve cross-tenant virtual-machine access by corrupting RSA keys. The issue affects chips produced by SK Hynix, Micron, and Samsung. NOTE: tracking DRAM supply-chain issues is not straightforward because a single product model from a single vendor may use DRAM chips from different manufacturers.

Technical summary Written by usOur analysis, written from the advisory, the CVSS vector and the affected-version data. It adds context the advisory leaves out, and never invents facts that are not in the source.

dbcve analysis · high confidence

CVE-2020-10255 reveals that the Target Row Refresh (TRR) mitigation in modern DDR4 and LPDDR4 DRAM chips (manufactured after 2015) can be bypassed through carefully crafted memory access patterns, allowing attackers to induce bit flips (Many-sided RowHammer attack) and achieve kernel privilege escalation, Sudo binary corruption, and cross-tenant VM access via RSA key corruption.

MitigationApply vendor firmware/microcode updates when available; replace affected DRAM modules from SK Hynix, Micron, and Samsung; consider software mitigations such as memory encryption (TME/MKTME), increased refresh rates, or memory isolation to reduce attack surface.

Verify against the referenced sources before acting — the references below are authoritative for this CVE, this summary is not.

Affected products & versions What the vendor confirmedThe version ranges the vendor confirmed as vulnerable. If your version sits inside a range here, treat yourself as exposed until you have upgraded.

NVD · CPE data
Ddr4 SdramHardware / appliance
Affected:all versions
Lpddr4Hardware / appliance
Affected:all versions
Ddr4Hardware / appliance
Affected:all versions
Lpddr4Hardware / appliance
Affected:all versions
Ddr4 SdramHardware / appliance
Affected:all versions
Lpddr4Hardware / appliance
Affected:all versions

CVSS breakdown How the score is builtThe industry scoring standard. It rates how the flaw is reached, what it takes to exploit, and what an attacker gains — the score is derived from those, not the other way round.

From the vector
Attack vector
Network
Complexity
High
Privileges
None
User interaction
None
Scope
Changed
Confidentiality
High
Integrity
High
Availability
High

CVSS:3.1/AV:N/AC:H/PR:N/UI:N/S:C/C:H/I:H/A:H

Am I affected? How to checkSteps we derive from the advisory and the affected-version data, so you can decide whether this CVE reaches your setup. They are a guide, not a scan — your own configuration is the authority.

dbcve checks

Work through these to decide whether this CVE applies to you.

  1. Identify installed DRAM type
    Run 'dmidecode -t memory' or check system BIOS/UEFI memory information to determine if DDR4 or LPDDR4 modules are installed
    Affected if System uses DDR4 or LPDDR4 memory modules from affected vendors
  2. Identify DRAM vendor
    Run 'dmidecode -t memory' and examine the 'Manufacturer' or 'Part Number' field for Micron, Samsung, or SK Hynix
    Affected if DRAM modules are manufactured by Micron, Samsung, or SK Hynix
  3. Check DRAM manufacturing date
    Run 'dmidecode -t memory' and look for manufacturing date in the 'Date' or 'Locator' field; for cloud VMs, check instance metadata or contact cloud provider for hardware details
    Affected if DRAM modules were manufactured after 2015 (CVE specifically affects post-2015 chips)
  4. Verify system has software mitigations in place
    Check if memory encryption (TME/MKTME) is enabled via 'lscpu' or BIOS settings; verify if increased DRAM refresh rates are configured in BIOS/UEFI
    Affected if No hardware-based or software-based RowHammer mitigations are enabled and the system meets criteria in steps 1-3

System is likely affected if it uses DDR4 or LPDDR4 memory from Micron, Samsung, or SK Hynix manufactured after 2015 with no RowHammer mitigations (TME/MKTME, increased refresh rates, or memory isolation) enabled

Generated from the published advisory. Verify against your own configuration.

Check your environment

Paste your version and any relevant configuration and it will be compared against the affected criteria above. Do not include secrets or credentials.

AI-assisted, checked against the advisory. Informational, not a guarantee.

Remediation Closing itWhat it takes to close this. Where a vendor fix exists we point at it; where none exists we say so plainly, and can build one. Effort estimates are scoped from the advisory, not from your codebase.

dbcve · scoped
Mitigation available No clean upgrade yet — mitigate in the meantime
Mitigation

Apply vendor firmware/microcode updates when available; replace affected DRAM modules from SK Hynix, Micron, and Samsung; consider software mitigations such as memory encryption (TME/MKTME), increased refresh rates, or memory isolation to reduce attack surface.

Recommended fix High confidence
  1. This is a hardware vulnerability in DRAM chips (DDR4/LPDDR4) that cannot be fixed via software upgrades, patches, or configuration changes.
  2. Verify if your hardware is affected by checking the DRAM chip manufacturer (SK Hynix, Micron, or Samsung) and production date (post-2015).
  3. Contact your hardware vendor to inquire about replacement with newer DRAM chips that have improved TRR (Target Row Refresh) implementations.
  4. Consider deploying memory error-correcting code (ECC) as a partial mitigation to detect bit flips.
  5. At the OS level, consider applying RowHammer kernel mitigations (e.g., Linux kernel's memory controller shuffling or refresh rate adjustments) as a defense-in-depth measure, though these provide limited protection against this vulnerability.
Caveat This hardware vulnerability cannot be remediated through software; physical DRAM replacement is required

Generated from the published advisory — verify against the referenced sources before acting.

Fix this in Ddr4 Sdram Scoped from the published advisory
  • Consultation12.0 h
  • Implementation60.0 h
  • Testing24.0 h
  • Review / QA12.0 h
108.0 hours of engineering $18,960
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References Go to the primary sourcePrimary sources — vendor advisories, patches and trackers. Where our summary and a reference disagree, the reference wins.

Primary sources

Practitioner notes

Contributed

Peer-ranked notes from engineers who’ve handled CVE-2020-10255 in production — separate from our analysis above.

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What this is

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What belongs here
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  • Version or environment caveats, and links to real fixes
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